Engineering Scholar Opportunity

Hello everyone, my name is Maya Tackaberry. I am a second year student at Saint Paul College who is pursuing an Engineering Degree. I am raising money to attend an International Engineering and Technology Scholar Delegation in China. This is an assembly of engineers chosen from around the world to meet and learn even more about the technology around us. I was invited to attend this event after maintaining academic excellence and because I am a member of Phi Theta Kappa Honors Society. Engineering has been a dream of mine since high school and I plan to learn, achieve, and experience as much as I can on this journey. This specific opportunity will allow me to do so. The date is May 29th of 2018, and I have to raise money for airfare and tuition costs. I am so very thankful to be on the path that I am, and with this experience I will see and learn even more. This will allow me to grow as an engineer, and contribute my knowledge to society. I am very appreciative for the support during this journey of becoming an engineer.